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Advantages of half cell panels：

1、 Technology

Use laser cutting method to cut the standard battery chip into two identical half pieces along the direction perpendicular to the main grid line of the battery, and then weld them in series.

Since the voltage of the solar crystalline silicon cell is independent of the area, but the power is proportional to the area, the voltage of the half cell is unchanged compared with the whole cell, the power is halved, and the current is halved.

workmanship：

In order to be consistent with the overall output voltage and current of conventional modules, half cell modules generally adopt the series parallel structure design, which is equivalent to two small modules in parallel.

As for packaging technology, the half cell module is the same as the conventional module, which is packaged with tempered glass, EVA and backplane. The junction box will be different, generally using a three part junction box.In terms of technology, the process change of the half chip module is simple. As the number of battery chips doubles, the time for battery series welding will also double. The difficulty is that the bus strip lead out wire is led out from the middle of the back of the module, and the bus strip welding automation has also promoted the development of the half chip battery module to a certain extent.

2、 Features

Because the internal circuit and internal friction are reduced, the packaging efficiency is improved; In addition, the working temperature of the module is reduced, reducing the probability of hot spots, and improving the * * performance and safety of the module. In terms of shadow occlusion, due to its special design, it has better anti occlusion performance than conventional components. Compared with traditional components, half chip components are mainly shown in three aspects:

（1）. Reduce heating and temperature loss

As the internal current and internal loss are reduced, the working temperature of the module and junction box decreases, and the probability of hot spot and the risk of damage to the entire module are greatly reduced. Under the outdoor working condition of the module, the temperature of the half module is about 1.6 ℃ lower than that of the conventional whole module.

（2）. Reduce shielding loss

The minimal shade of trees and wire shadows in the photovoltaic system can reduce the power generation of the power station by about 20-30%. However, according to a newly released national household photovoltaic inspection report, 52.6% of the power stations are sheltered. Among these sheltered power stations, 46.4% are covered by foreign objects, and 53.6% are covered by power stations themselves.

With its special parallel string structure, the half piece module can improve the utilization rate of supports and land while reducing the power generation loss caused by shadow shielding. In the case of shadow occlusion and dust deposition on the edge of components, the half slice technology can reduce the power loss by 3/4; Especially in the case of full width occlusion, the output power of conventional modules is almost zero, while the half chip module still retains about half of the output power thanks to the internal circuit design.

3、 Improve packaging efficiency

The packaging loss of conventional components is generally greater than 1%, while that of half chip components is generally about 0.2%. Therefore, the half chip module makes use of the low current characteristics to effectively improve the packaging efficiency of the module.

Development trend：

With the increasing pressure on power station investors to access the Internet at parity, the demand for electricity cost per kilowatt hour is getting higher and higher. Compared with conventional components, the cost of half chip components mainly increases in the manufacturing process, including battery slicing, auxiliary materials and labor costs, equipment depreciation costs, etc. However, the power of the half chip module can be improved by 5W-10W or even * higher than that of the module of the same version. As the component price continues to decline, the overall system cost of the half chip component is reduced.